Materials innovation for next-generation semiconductor integration — from novel 2D materials to monolithic 3D architectures.
Wafer-scale 2D GAAFETs and monolithically stacked CFETs, pushing logic scaling beyond the limits of silicon.
Ferroelectric FeFETs and oxide memory cells, grown directly on top of logic for dense, low-power storage.
Single-crystal 2D materials grown below 400°C — the enabling technology behind monolithic integration.
SIM Lab (Semiconductor Integration Materials Laboratory) begins its research activities at the Division of Materials Science and Engineering, Hanyang University.
